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Menu
About Us
Corporate Profile
Corporate Information
Corporate Social Responsibility
Semiconductor Value Chain
Our Solutions
Technology
Design Solutions
Services
Manufacturing
Manufacturing
Accreditation
Environmental, Health & Safety (EHS)
Quality and HSPM
End Markets
News
Announcements
Events
ESG
Career
Our People
Why Join Us
Vacancies
Internship Opportunities
Career Fair
Contact Us
MPW Program
MyFab
Vendor Management
DNeXPOST
MPW Program
MyFab
Vendor Management
DNeXPOST
Piezoelectric Surface Acoustic Wave MEMS Process Platform (SAW)
SAW MEMS Key Features
Aluminum Nitride based SAW device integrated over CMOS. Archived maximum Surface acoustic velocity of 4000m/sec. Q is >3000.
Resonant Frequency >320 MHz
4-6 additional mask layers to implement this on the top of the traditional CMOS devices.
Uncompensated TCF < 10 ppm/degC.
Unmatched Insertion loss <35dB @ 320 MHz
Low power consumption. Excellent for IoT and wireless based products.
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